@article {178,
	title = {A study of stacked PECVD silicon nitride films used for surface micromachined membranes.},
	journal = {Thin Solid Films},
	volume = {516},
	year = {2008},
	note = {CAPLUS AN 2008:1086703(Journal)},
	month = {2008///},
	pages = {8788 - 8792},
	publisher = {Elsevier B.V.},
	abstract = {Silicon nitride stacked films contg. three layers differing in mech.-chem. properties are synthesized using plasma-enhanced chem. vapor deposition method from monosilane (SiH4) and ammonia (NH3) mixt.  The compn. is analyzed using XPS and stress is measured using a substrate bending method.  The ability to obtain stacked films with the custom tensile stress in the overall structure was demonstrated by the series of expts.  The tensile stress in the top and bottom films was obtained between 200 and 300 MPa whereas the stress in the middle film could be adjusted from compressive 60 MPa to tensile 300 MPa.  Since the appropriate stress value is important in achieving required mech. properties of the membranes, the results obtained are discussed in the context of surface micromachined membrane structures. [on SciFinder(R)]},
	keywords = {plasma CVD stacked silicon nitride film surface micromachined membrane},
	isbn = {0040-6090},
	author = {Mikolajunas, M. and Kaliasas, R. and Andrulevicius, M. and Grigaliunas, V. and Baltrusaitis, J. and Virzonis, D.}
}
